Intel starts next phase of $20B Ohio manufacturing project

Crews officially poured 1,500 cubic yards of concrete this month at Intel’s Ohio One manufacturing site, according to a company tweet on May 18.

The milestone marks the completion of the first phase of the project and the beginning of the next phase of construction for the $20 billion semiconductor facility in Licking County, located east of Columbus, Ohio. The Intel project spans nearly 1,000 acres, can eventually contain up to eight semiconductor factories and ranks as the largest private-sector investment in Ohio history.

Intel, a Santa Clara, California-based semiconductor chip manufacturer, selected Rhode Island-based Gilbane Building Co. to manage the initial phase of the project, which broke ground in September. The general contractor for the next phase has not yet been announced.

Despite a 68% drop in manufacturing starts in April, manufacturing projects remain strong year over year, largely because of massive sites like Intel’s facility in Licking County.

Private sector companies have announced nearly $140 billion in investments in semiconductor production, supply chains and research and development to be made over the next decade, according to a White House press release. Intel CEO Pat Gelsinger said during the groundbreaking ceremony in September that the $52.7 billion federal CHIPS Act played a critical role in allowing construction to move forward on the massive project.

The facility is Intel’s largest construction project to date, said Jackie Sturm, Intel’s corporate vice president of global supply chain operations. Intel officials expect production to start in 2025.

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